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DOUBLE SIDED LAPPING/POLISHING MACHINE
YJ-13B5L/PA
Introduce
DOUBLE SIDED LAPPING/POLISHING MACHINE YJ-13B5L/PA
This machine is suitable for lapping and polishing of semi-conductor material, metal, and non -metal parts such as valve plate, rigid seal pad, piston ring, sapphire, and glass, as well as ultra-thin and fragile parts, such as quartz crystal.
Peculiarity
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01
Two motors. Carriers rotate between upper and ower plates. Both sides of work pieces can be evenly lapped.
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02
Ring gear position is adjustable by jog operation.
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03
Variable frequency speed governor realizes soft start, and soft stop. Machine can work under any speed which is within setting range.Speed changing is stable, and with no impact.
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04
Mechanical safety device prevents upper plate from falling down.
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05
Carriers can rotate clockwise and counter-clockwise by adjusting sun gear speed. lt will realize plate conditioning.
Argument
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Upper/Lower plate sizeφ849×φ274×30 mm
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Thickness of workpiece25 mm
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Dimensions of workpieceφ270 mm
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Dimensions of workpiece0～60 rpm
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Number of Planet gears5
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Lifting stroke of inner gear ring0～25 mm
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3相(phase)0.75 kw 1450 r/min3相(phase)0.75 kw 1450 r/min
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Main motor3相(phase) 7.5 kw 1450 r/min
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Vice motor3相(phase) 0.75 kw 1450 r/min
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Slurry pump motor250 W
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Air pressure0.5-0.6 Mpa
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Working pressure0.45-0.6 Mpa
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Size1545×1500×2810 mm
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Weight~3200 Kg
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