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DOUBLE SIDED LAPPING/POLISHING MACHINE
YJ-9.6B10L/PE
Introduce
DOUBLE SIDED LAPPING/POLISHING MACHINE YJ-9.6B10L/PE
The machine is suitable for double side lapping and polishing of thin and fragile metal or non-metal parts such as silicon wafer, crystal guartz, optical crystal, glass, jewelry, lithium niobium acid, gallium arsenide, and ceramic wafer, etc.
Peculiarity
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01
Equipped with three motors. Both sides of work pieces can be evenly lapped.
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02
Ring gear position is adjustable by jog operation.
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03
Lower plate can be adjusted by the three-point supporting structure.
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04
Variable frequency speed governor realizes soft start, and soft stop. Machine can work under any speed which is within setting range.
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05
High quality pnuematic components ensures stable up and down movement.
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06
Sun gear and ring gear speed can be adjusted seperately.
Argument
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Upper/Lower plate sizeφ622×φ286×40(mm)
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Thickness of workpiece最大Max:20(mm)
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Dimensions of workpiece最大Max:φ100(mm)
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Lower plate rotational speed0-50(r/min)
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Number of Planet gears10
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Lifting stroke of inner gear ring0-25(mm)
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Main motor3相 3(kw) 1450 (r/min)
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Slurry pump motor120(W)
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Air pressure0.5-0.6(Mpa)
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Working pressure0.45-0.6(Mpa)
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Size LxWxH1460×1178×2490(mm)
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Weight~1900(Kg)
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