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DOUBLE SIDED LAPPING/POLISHING MACHINE
YJ-13B6L/PD
Introduce
DOUBLE SIDED LAPPING/POLISHING MACHINE YJ-13B6L/PD
The machine is suitable for lapping and polishing of cell phone cover lens, silicon wafer, crystal quartz,optical crystal, optical glass, lithium niobium acid, galium arsenide, ceramic wafer and other hard and fragile metal or non-metal materials.
Peculiarity
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01
Three motors. One motor drives the lower plate and ring gear; upper plate and sun gear is controlled by separate motors.
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02
The length of the drive shaft is effectively shortened, mechanical rigidity of the machine is increased.
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03
Ring gear position is adjustable by jog operation.
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04
Variable frequency speed governor realizes soft start, and soft stop. Machine can work under any speed which is within setting range.
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05
Mechanical safety device prevents upper plate from falling down.
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06
Sun gear can be adjusted seperately.Process craft is adjutable.
Argument
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Upper(Lower) plate sizeφ975×φ391×40(35)mm
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Number of carriers / Dimensions of workpiece6/MaxΦ270(mm)
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Upper plate rotational speed / Lower plate rotational speed5~40(rpm)/5~55(rpm)
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Sun gear rotational speed / Inner gear ring rotational speed3~30(rpm)/3~18(rpm)
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Upper plate motor / Lower plate motor3相 7.5kw 1450rpm
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Sun gear motor3相 1.5kw 1450rpm
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Upper plate pressure range0~250kg
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Equipment size1685×1490×2610mm
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Weight~2850 Kg
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