Introduce
DIAMOND WIRE
Customized services and automated operation provide finer wire diameter, higher hardness, and greater efficiency.
Peculiarity
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01
The production machine which is designed by ourselves with independent intellectual property rights. Stable servo system is equipped.
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02
High degree of automation and the application of automatic plating bath management system and automatic visual inspection device can meet the production needs of ultra-fine diamond wire.
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03
Adopt lower cutting rate design, The thickness is 1-2μm thicker than that of other manufacturers, which increases the wafer cutting production rate.
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04
The fracture strength of diamond wire is high and stable, and the distribution of diamond particles is uniform.
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05
No agglomeration, uniform diameter of diamond, strong adhesion of coating, no peeling and crack,compact and smooth coating.
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06
The product can be customized to be compatible to all kinds of cutting process requirements.
Application
We adopt different machine models + diamond wire to address the cutting needs of various materials.
Argument
- Application field
Specs
μm
Core wire
μm
Wire diameter
μm
Breaking force(um)
μm
Diamond powder particle size
μm
- Magnetic material12090115-125>2810-20145100135-15523020-30150105150-17523320-30170120160-18024020-30200140190-21025330-40220160210-23027030-50
- Sapphire/Silicon carbide140100140-150≥3020-30175120170-185≥4125-35200135195-215≥5530-40250175240-260≥7530-40
- Monocrystalline/ polysilicon28鎢絲28+244+2≥6.25-103232+247+2≥6.15-103333±248+2≥6.15-103535+250+2≥6.65-103838+253+2≥7.46-124646+259+2≥9.16-125353+269+2≥11.56-125555+270+2≥12.56-125757+272+2≥13.26-12
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