

MULTI-WIRE SAW
YJ-XQB816C Diamond wire applications
The machine is mainly used for cutting and decomposing various hard and fragile materials such as cutting sapphire (2"-8 "”), crystal, ceramics, compounds, oxides, artificial gems, single crystal silicon into flakes, which improves the cutting accuracy and working efficiency.
01
Achieve high-speed cutting which up to 3000m/min.
02
Stable servo system is equipped.
03
The down-cut rocking mode workplate increase the cutting efficiency and support to adjust the silicon direction.
04
Wire tension is controlled by servo motor. Tension precision is within 士 0.5N.
05
The surface sheet metal of the machine is made of 304 stainless steel, which is convenient for cleaning and maintenance.
06
Unique sealing methods of the cutting room and wire supply room ensures the oil slurry is not leaking.
07
Our patented wire breakage protection device can greatly reduce the damage to the wire and roller after wire break.
08
Equipped with 6 pieces of big pulleys.
09
he maximum processing size is: 8"x400mm.
10
The take-up and pay-off sides are equipped with servo motor cable arrangement to realize bidirectional wire feeding.
11
Each door of the cutting room is automated and can be raised and lowered with one click, making it safe and convenient.