MULTI-WIRE SAW
YJ-XQL921HS
Introduce
MULTI-WIRE SAW YJ-XQL921HS
This machine is mainly used for cutting solar monocrystalline silicon and polysilicon materials, etc., suitable for efficient cutting of large size silicon wafers of 182 ×182mm,182×210mm,210 × 210mm and 230 × 230mm.
Peculiarity
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01
Achieve high-speed cutting which up to 2400m/min.
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02
Stable servo system is equipped.
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03
The four-speed wheelbase is adjustable to achieve compatible cutting of silicon rods of different sizes.
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04
Wire tension controlled by servo motor. Tension precision is within 士 0.1N.
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05
New solution reduces the line spacing between guide wheels and reduces additional tension.The mortar tank volume is >800L, reducing the concentration of silicon powder.
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06
The electrical cabinet is placed on the back of the equipment, and the back-end automation directly connects the silicon rods to the cutting position.
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07
Our patented wire breakage protection device can greatly reduce the damage to the wire and roller after wire break.
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08
The smaller pulley can decrease the moment of inertia so as to reduce the friction damage to the wire to adapt to the finer wire.
Argument
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Maximum workpiece size230×230×950mm
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Roller size(Ф150mm-Ф160mm)x960(mm Coating length)
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Roller number3個
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Bobbin wiring capacity120-240km
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Wire diameterΦ0.025-0.06mm
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Cutting line speed≤2400m/min
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Roller distance310mm(105x210mm/91x182mm) 360mm(182x182mm/182x210mm) 395mm(210mmx210mm) 410mm(230mmx230mm)
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Power supply/Power consumption3 phase-380V/120KVA(Max260KVA)
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Cutting fluid tank volume800L
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Size L×W×H5435mmx2430mmx3430mm(包含懸臂)
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Weight13000kg
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