

SILICON WAFER PROCESSING
ONE STATION ULTRA-THIN SILICON WAFER SERVICE
01
The equipment is independently developed and manufactured.
02
Large variable axis ensures a wide range of wafer processing sizes and issuitable for wafer sizes from 166 to 230 as well as 210 half wafers.
03
Our inspection standard to processed silicon wafer is more strict. The test items such as TTV and thread trace value are lower than the industry standard value 2μm.
04
The distribution range of wafer thickness is within 1μm.
We offer customized slicing services based on customer needs; related products have TTV and scratch control values lower than industry standards.
Items | (mm*mm) Size | Thickness(μm) |
Standard piece | 166*166(P/N型) | 150/145/140/135/130/125/120及以下 |
182*182(P/N型) | 150/145/140/135/130/125/120及以下 | |
210*210(P/N型) | 150/145/140/135/130/125/120及以下 | |
Specialshape piece | 210*182(P/N型) | 150/145/140/135/130/125/120及以下 |
191*182(P/N型) | 150/145/140/135/130/125/120及以下 | |
Half piece | 210*105(N型) | 130/120/110/100/90及以下 |
182*91(N型) | 130/120/110/100/90及以下 |