

INTRODUCTION TO C/C COMPOSITE
01
The equipment is independently developed and manufactured.
02
Large variable axis ensures a wide range of wafer processing sizes and issuitable for wafer sizes from 166 to 230 as well as 210 half wafers.
03
Our inspection standard to processed silicon wafer is more strict. The test items such as TTV and thread trace value are lower than the industry standard value 2μm.
04
The distribution range of wafer thickness is within 1μm.
Name | C/C composite profile | ||
type | YXCC-S14 | YXCC-P16 | YXCC-P18 |
densitylg /cm3 | ≥1.4 | ≥1.6 | ≥1.8 |
Heat tredment temperafure /°C | >2300 | >2300 | >2300 |
Tensile strength /MPa | ≥120 | ≥140 | ≥160 |
Compression strength/Mpa | >130 | >150 | >160 |
Ash content /ppm | <200 | <200 | <200 |
Thermalconductivity/W/mk | >40 | >50 | >60 |
Others | Provide semiconductor grade products with ash lower than 20ppm |