

INTRODUCTION TO C/C COMPOSITE
01
The equipment is independently developed and manufactured.
02
Large variable axis ensures a wide range of wafer processing sizes and issuitable for wafer sizes from 166 to 230 as well as 210 half wafers.
03
Our inspection standard to processed silicon wafer is more strict. The test items such as TTV and thread trace value are lower than the industry standard value 2μm.
04
The distribution range of wafer thickness is within 1μm.
名稱(Name) | 碳/碳復合材料異形件(C/C composite profile) | ||
類型 | YXCC-S14 | YXCC-P16 | YXCC-P18 |
密度 | ≥1.4 | ≥1.6 | ≥1.8 |
熱處理溫度 | >2300 | >2300 | >2300 |
抗拉強度 | ≥120 | ≥140 | ≥160 |
抗壓強度 | >130 | >150 | >160 |
灰分 | <200 | <200 | <200 |
導熱系數 | >40 | >50 | >60 |
主要應用 | 導流筒、保溫桶、坩堝、堝邦、熱壓模具 |